SPI
Sigma X - PARMI Dual Laser 3D SPI Imashini yakoreshejwe / Gishya
Ibisobanuro
3D MuriSigmaXsisitemu yo kugurisha paste itanga udushya, inganda ziyobora inganda kugirango zongere agaciro mubucuruzi bwawe. Ibigezweho muburyo bwikoranabuhanga ryo gupima, bifatanije nigihe cyihuta cyinganda hamwe nibikoresho bidasanzwe byunganira inzira, byunguka byinshi mubushoramari ninyungu zawe.
- Ikoreshwa rya laser ebyiri ikuraho igicucu.
- Bihujwe namabara yose ya PCB, arangiza na HASLs.
- Kumenya ibintu byose, harimo bores, vias, inkombe yibibaho na crimps.
- Kugenzura umuvuduko wa 100? / Segonda kuri 10 × 10 micron ikemurwa, kimwe no guhita ubona ibisubizo, bitanga imikorere myiza muruganda.
- Kubaha cyane no kumenya neza hamwe n'ibipimo by'uburebure bwa +/- 1mm
HS60- PARMI 3D SPI Solder Paste Igenzura Imashini ikoreshwa
Ibisobanuro
PARMI SPI HS60 igaragaramo tekinoroji yubuhanga igezweho, harimo iyerekwa rya SMT ryubwenge, tekinoroji-yikizamini (PnT), hamwe no kugaburira robot ifite ubwenge. Ifite ibikoresho bitatu bya nozzles, bibiri muri byo bikoreshwa mugushiraho SMT nozzle imwe yo kwandikisha iyerekwa. Sisitemu ifite ibikoresho bya auto-focus laser umutwe kugirango pin yandikwe neza.
Umutungo wa SPI HS60 urashobora kubyara umusaruro mwinshi, hamwe nubunini ntarengwa bwa 10 'x 10'. Ni imashini itandukanye cyane, ishoboye gutunganya ibice bitandukanye, nka BGA na CSPs, kimwe nabagurisha badafite isasu. Mubyongeyeho, iragaragaza uburyo bwiza bwa chip module, ituma chip yihuta yihuta. Ubu bushobozi, hamwe nibindi bikoresho byabwo, butuma iyi moderi itunganyirizwa guteranya PCB no gukora imirimo yo gukora imishinga mito n'iciriritse.