Xceed
Xceed - PARMI Laser Inline 3D AOI E Sebelisitsoe / E Ncha
Ho lemoha ka bohlale:Ha e angoe ke thepa ea PCB, bokaholimo le 'mala
• PCB e Lefifi
• PCB e tšoeu
• PCB ea lik'hemik'hale tsa ceramic
• Likarolo tse bonahatsang
Setšoantšo sa 'nete sa 3D
• Theknoloji e tsoetseng pele ea ho sebetsana le matšoao ho bontša litšoantšo tsa 'nete le tse hlakileng tsa 3D ntle le lerata
Barcode le Tsebo ea Lesupa le Lebe
• Tlhahlobong e le 'ngoe, ka bobeli Barcode le Bad Mark li lemohuoa ka nako e le ngoe. 1D, 2D, QR Laser Marking, le Printa barcodes lia hlokomeleha.
Mefuta eohle e mebe e ka bonoa
• Dimension, tse sieo, maemo a fosahetseng (X/Y/Rotation), e fosahetse ('Mele), Lehlakoreng la Mount, Tombstone, Text (OCV/OCR), Fosahetse (Matching), Solder Joint, lead Offset, Bridge, Color band, Pin, Coplanarity , e ka bonoa ka ho phethahetseng.
- Boholo ba Thepa (W x D x H): 850mm (W) × 1205mm (D) × 1525mm (H)
• Boima ba Thepa (kg): 750 kg
• Melao-Motheo ea ho Lekanya : Shadow Free Dual Laser Optical Triangulation
• Sisteme ea Khamera : 4 Mega Pixel
• Mohloli oa Leseli : RGBW LED
• Lebelo la Scan (cm2/sec) : 65 cm2/sec
• Qeto ea XY (um): 14 x 14 um
• Qeto e Phahameng : 0,4 um
• Pheta-pheta e Phahameng : 3б
• Ho nepahala ho Phahameng :
• Mofuta oa Tlhahlobo: Bophahamo, bo Fokollang, Maemo a Maemo (X/Y/Potoloho), Phoso ('Mele), Thaba ea Lehlakoreng, Lejoe la Tombstone, Mongolo (OCV/OCR), E fosahetse (e Matching), Solder Joint, lead Offset, Bridge, Colour band, Pin, Coplanarity
• PCB Warpage : ±5mm (2%)
• Barcode : Tlhahlobo ea Barcode ea 1D/2D/QR u sebelisa TRSC-I
• Boholo Bophahamo ba Karolo : 40mm