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E by DEK - ASM Inline Solder Paste Printer

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E by DEK - ASM Inline Solder Paste Printer

    Features

    E-Quality
    DEK’s experienced printing specialists have developed an innovative platform for E by DEK with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest fine-pitch applications.
    E-Performance
    The E by DEK delivers E-Performance with:
    8 seconds core cycle time
    Fast setup changeovers
    High repeatability
    With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.
    E-Facts
    Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.
    * Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.
    # Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.
    E By DEK
    Flexibility at its best!
    Each SMT factory has its own special challenges. That is why we have developed Options for the E by DEK that allow custom tuning with perfectly coordinated modules for printing results that will make your customers happy and raise your SMT production to a new level.
    E by DEK Options for all your applications:
    Throughput
    Quality
    Flexibility
    Long and heavy circuit boards

    Alignment

    > 2.0 Cmk @ ± 12.5 μm (± 6 sigma)

    System alignment capability

    > 2.0 Cmk @ ± 25 μm (± 6 sigma)

    Optimum core cycle time

    8 seconds

    Substrate size

    50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y)

    Operating System

    Windows 7 Embedded

    Squeegee pressure mechanism

    Software-controlled, motorized with closed loop feedback

    Stencil positioning

    Semi-auto stencil load with drip tray

    Understencil cleaning

    Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe

    Adjustable-width stencil mount (AWSM)

    Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm

    Substrate thickness

    0.2 mm to 6 mm

    Substrate weight (maximum)

    6 kg

    Substrate warpage

    Up to 7 mm including substrate thickness

    Substrate fixture

    Over the top clamp

    Edge clamp

    Foil-less clamp

    Vacuum

    Temperature & humidity sensor

    Monitoring of the process environment