E ta DEK - ASM Inline Solder Manna Printer
Siffofin
E-Quality
ƙwararrun ƙwararrun ɗab'i na DEK sun haɓaka ingantaccen dandamali don E ta DEK tare da ingantattun abubuwan haɗin gwiwa, nagartaccen gini, da ƙirar ƙira waɗanda ke ba da tabbacin ingantaccen tsarin bugu mai dogaro har da sabbin aikace-aikace masu kyau.
E-Performance
E ta DEK yana ba da Ayyukan E-Performance tare da:
8 seconds ainihin lokacin zagayowar
Saurin saitin canje-canje
Babban maimaitawa
Tare da mafi ƙarancin lokutan sake zagayowar da mafi saurin samfuran canjin samfuran haɗe tare da matsakaicin maimaita daidaito, E ta DEK yana saita sabbin ma'auni a cikin ɓangaren tsakiyar sauri.
E-Gaskiya
An tsara shi sosai, kuma kowane lamba yana ba da hujja mai ƙarfi: Mafi mahimmancin gaskiya da ƙididdiga akan E ta DEK.
* Abubuwan cancantar daidaitawa sun haɗa da lodin allo / saukarwa, datse allo, motsi kamara / tebur. Ana ƙididdige ƙimar iyawa tare da software na QC-Calc na ɓangare na uku.
# Ƙarfin injin ya ƙunshi saukar da allo / saukewa, ƙulla allo, kyamara / motsi tebur da tsarin bugawa. Ana ƙididdige ƙimar ƙarfin aiki tare da software na QC-Calc na ɓangare na uku.
E ta DEK
Sassauci a mafi kyawun sa!
Kowane masana'anta na SMT yana da nasa ƙalubale na musamman. Abin da ya sa muka haɓaka Zaɓuɓɓuka don E ta DEK waɗanda ke ba da damar daidaitawa na al'ada tare da ingantattun kayayyaki masu daidaitawa don buga sakamakon da zai sa abokan cinikin ku farin ciki da haɓaka samar da SMT zuwa sabon matakin.
E ta Zaɓuɓɓukan DEK don duk aikace-aikacenku:
Kayan aiki
inganci
sassauci
Dogayen allo masu nauyi
Daidaitawa | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
Ƙarfin daidaita tsarin | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
Mafi kyawun lokacin zagayowar asali | 8 seconds |
Girman Substrate | 50 mm (X) x 40.5 mm (Y) zuwa 620 mm (X) x 508.5 mm (Y) |
Tsarin Aiki | Windows 7 Embedded |
Injin matsa lamba na Squeegee | Mai sarrafa software, mai motsa jiki tare da rufaffiyar madauki |
Matsayin Stencil | Semi-auto stencil load tare da drip tray |
Fahimtar tsaftacewa | Mai tsabtace ƙasa mai musanya (IUSC), mai cikakken shirye-shirye tare da gogewar rigar/bushe |
Daidaitacce-nisa stencil Dutsen (AWSM) | Bambance-bambancen Frame - cikakken daidaitacce don ɗaukar girman firam a cikin kewayon 381 mm zuwa 736 mm |
Substrate kauri | 0.2 zuwa 6 mm |
Nauyin Substrate (mafi girman) | kg 6 |
Substrate warpage | Har zuwa 7 mm ciki har da kauri substrate |
Substrate kafa | Sama da matsi Matse gefen Matsa mara-ƙasa Vacuum |
Zazzabi & zafi firikwensin | Kula da yanayin tsari |