HS60- PARMI 3D SPI Solder Paste Inspection Machine i hoʻohana ʻia
Nā kikoʻī | ||||||
SPI moʻo | HS60 moʻo | HS70 moʻo | HS70DH | |||
Kāmeʻa 3D | Ke poʻo ʻenekia | RSC5 | (Kiʻekiʻe) RSC6-HS | RSC6-HS | RSC6-HR | RSC6-HSx2 |
| Māmā (sq.cm/sec) | 60 | 100 | 100 | 80 | 100 |
| X,Y hoʻoholo(um) | 18x18 | 13x13 | 13x13 | 10x10 | 13x13 |
| Lateral lōʻihi (mm) | iwakāluakūmākolu | 32 | 32 | iwakāluakūmālua | 32 |
| Hoʻoholo kiʻekiʻe (um) | 0.2 | 0.2 | 02 | 0.1 | 02 |
hana | Hiki hou | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma |
| Pono (um/kiʻekiʻe) | 2 | 2 | 2 | 2 | 2 |
| ʻO Gage R&R |
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Ana ana | Min.Solder Paste Nui (um) | 200×200 | 150x150 | 150x150 | 100x100 | 150x150 |
| Max.Solder Paste Nui (hoʻokahi) | 20x20 | 20×20 | 20×20 | 20×20 | 20x20 |
| Min.Solder Paste Pitch(hoʻokahi) | 100 | 100 | 100 | 80um | 100 |
| ʻO ke kiʻekiʻe o ke kiʻekiʻe o ka ʻili | 1000um | ||||
| Ana ltem | Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
| PCB Warpage | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) |
Papa | Nui min(L*W) | H860,60L: 50×50 | HS60, 60L Kiʻekiʻe.50×50 | HS70:80×80 | 80×80 | 80×80 |
| Nui Nui | HS60: 360×260 | HS60 Kiʻekiʻe: 340x260 | HS70D: 420×350 | HS70D: 340×315 | 350×250 |
| mānoanoa | 0.4mm a 4mm | ||||
| Iluna/lalo | HS60: 25/25 | HS60 Kiʻekiʻe: 25/25 | 0 | 4/23 | 4/20 |
| Iluna/lalo | HS60, 60L, 60XL: 2.5/3.5 | HS60, 60L, 60XL Kiʻekiʻe: 2.5/3.5 | HS70, 70L: 2.5/3.5 | HS70D, 70DL: 2.5/3.5 | 2.5/4.0 |
| Kaumaha PCB (kg) | HS60: 2 | HS70: 2 | 1.5 | ||
kamepiula& | CPU | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) |
| Memory(GB) | HS60, HS60L: 8 | 8 | HS70: 8 | 16 | 8 |
| Mākaʻikaʻi | 20*Akea | ||||
| Pūnaehana Hana | MS-Windows XP Professional 64-bit/window 7 | ||||
Mea hoohana | Mana(kw) | AC 220V (50/60Hz, 1 Māhele) | ||||
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| HS60:1.5 | 2.3 | HS70: 1.7 | 2.3 | 3.5 |
| Ea | 5Kgf/sq.cm | ||||
Pūnaehana | Anana | HS60: 900x1000xl480 | HS60 Supereme: 900x1000x1480 | HS70: 970x1195x1535 | HS70D 1:920x1415x1510 | 1296x1980x1510 |
| Kaumaha(kg) | HS60: 750 | HS60 Supereme: 750 | HS70:800 | 900 | 1000 |
Nā koho kiʻekiʻe {Calibration Jig}, 1D 2D Barcode System, Closed Loop System |