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HS60- PARMI 3D SPI Solder Paste Inspection Machine i hoʻohana ʻia

HS60

Nā Māhele Huahana
Nā Huahana Hōʻikeʻike

HS60- PARMI 3D SPI Solder Paste Inspection Machine i hoʻohana ʻia

wehewehe

Hōʻike ka PARMI SPI HS60 i kekahi mau ʻenehana holomua, me ka ʻike SMT naʻauao, ka ʻenehana wahi-a-hoʻāʻo (PnT), a me ka hānai robot naʻauao. Ua lako ʻia me ʻekolu mau nozzles, ʻelua o ia mau mea i hoʻohana ʻia no ke kau ʻana o ka nozzle SMT a hoʻokahi no ke kākau inoa ʻana. Hoʻolako ʻia ka ʻōnaehana me kahi poʻo laser auto-focus no ka pololei o ka hoʻopaʻa inoa pine.

Hiki i ka waiwai SPI HS60 ke hana nui, me ka nui o ka papa o 10' x 10'. He mīkini maʻalahi loa ia, hiki ke hana i nā ʻāpana like ʻole, e like me BGA a me CSP, a me nā mea kūʻai alakaʻi ʻole. Eia kekahi, ke hōʻike nei ia i kahi module chip i hoʻopaʻa ʻia, e hiki ai ke kau ʻana i ka chip kiʻekiʻe. ʻO kēia hiki, a me kāna mau hiʻohiʻona ʻē aʻe, e hoʻohālikelike i kēia kumu hoʻohālike no ka hui PCB a me nā hana hana no nā papahana liʻiliʻi a me waena.

    Nā kikoʻī

    SPI moʻo

    HS60 moʻo

    HS70 moʻo

    HS70DH

    Kāmeʻa 3D

    Ke poʻo ʻenekia

    RSC5

    (Kiʻekiʻe) RSC6-HS

    RSC6-HS

    RSC6-HR

    RSC6-HSx2

     

    Māmā (sq.cm/sec)

    60

    100

    100

    80

    100

     

    X,Y hoʻoholo(um)

    18x18

    13x13

    13x13

    10x10

    13x13

     

    Lateral lōʻihi (mm)

    iwakāluakūmākolu

    32

    32

    iwakāluakūmālua

    32

     

    Hoʻoholo kiʻekiʻe (um)

    0.2

    0.2

    02

    0.1

    02

    hana

    Hiki hou

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

     

    Pono (um/kiʻekiʻe)

    2

    2

    2

    2

    2

     

    ʻO Gage R&R

    Ana ana

    Min.Solder Paste Nui (um)

    200×200

    150x150

    150x150

    100x100

    150x150

     

    Max.Solder Paste Nui (hoʻokahi)

    20x20

    20×20

    20×20

    20×20

    20x20

     

    Min.Solder Paste Pitch(hoʻokahi)

    100

    100

    100

    80um

    100

     

    ʻO ke kiʻekiʻe o ke kiʻekiʻe o ka ʻili

    1000um

     

    Ana ltem

    Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Kiʻekiʻe, ʻāpana, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

     

    PCB Warpage

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    ±5mm(2%)

    Papa
    Dmension

    Nui min(L*W)

    H860,60L: 50×50
    H860D: 80×80
    HS60XL,60XXL:100x100

    HS60, 60L Kiʻekiʻe.50×50
    HS60D Hoʻohui.8DX80
    HS60XL Kiʻekiʻe:100x100

    HS70:80×80
    HS70L, HS70XL:100x100

    80×80

    80×80

     

    Nui Nui
    (L*W)

    HS60: 360×260
    HS60L: 520×510
    HS60XL: 700×510
    HS60XXL: 880X510
    HS60D: 340×315

    HS60 Kiʻekiʻe: 340x260
    HS60L Kiʻekiʻe: 500x510
    Nui HS60XL: 685x510
    HS60D Hoʻohui: 350x315

    HS70D: 420×350
    HS70L: 590×610
    HS70XL: 950×670

    HS70D: 340×315
    HS70DL: 590×610

    350×250

     

    mānoanoa

    0.4mm a 4mm

     

    Iluna/lalo
    Hoʻomaʻemaʻe
    (mm/mm)

    HS60: 25/25
    HS60L,60XL,60XXL: 18/25
    HS60d: 4/23

    HS60 Kiʻekiʻe: 25/25
    HS60L, 60XL. Kiekie: 25/25
    HS60D Hoʻohui: 4/23

    0

    4/23

    4/20

     

    Iluna/lalo
    Hoʻomaʻemaʻe Edge
    (mm/mm)

    HS60, 60L, 60XL: 2.5/3.5
    HS60XXL: 3.5/4.5
    HS60D: 25/3.5

    HS60, 60L, 60XL Kiʻekiʻe: 2.5/3.5
    HS60D Hoʻohui: 2.5/3.5

    HS70, 70L: 2.5/3.5
    HS70XL: 3.5/5.0

    HS70D, 70DL: 2.5/3.5

    2.5/4.0

     

    Kaumaha PCB (kg)

    HS60: 2
    HS60L, 60XL, 60XXL: 4
    HS60D:1.5

    HS70: 2
    HS70L,70XL: 10
    HS70D: 1.5
    H870DL: 3

    1.5

    kamepiula&
    Console

    CPU

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

     

    Memory(GB)

    HS60, HS60L: 8
    HS60XL, HS60XXL: 16

    8

    HS70: 8
    HS70L: 16
    HS70XL: 48

    16

    8

     

    Mākaʻikaʻi

    20*Akea

     

    Pūnaehana Hana

    MS-Windows XP Professional 64-bit/window 7

    Mea hoohana

    Mana(kw)

    AC 220V (50/60Hz, 1 Māhele)

     

     

    HS60:1.5
    HS60L, H60XL, HS60XXL: 1.8

    2.3

    HS70: 1.7
    HS70L: 1.8
    HS70XL: 2.0

    2.3

    3.5

     

    Ea

    5Kgf/sq.cm

    Pūnaehana
    Anana

    Anana
    (W*D*H)mm

    HS60: 900x1000xl480
    HS60L: 1060x1285x1480
    HS60XL: 1240x1285x1430
    HS60XXL: 1420×1285×1480
    HS60D: 1180x1395×1480

    HS60 Supereme: 900x1000x1480
    HS60L Supereme: 1060x1285x1450
    HS60XL Supereme :1240x1285x1480
    HS60D Hoʻohui: 1180x1435x1450

    HS70: 970x1195x1535
    HS70L: 1170x1335x1535
    HS70XL: 1530x1415x1535

    HS70D 1:920x1415x1510
    HS70D 3:1180x1475x1510

    1296x1980x1510

     

    Kaumaha(kg)

    HS60: 750
    HS60L, 60XL, 60XXL:1000
    HS60D: 900

    HS60 Supereme: 750
    HS60L, 60XL, 60XXL Supereme:1000
    HS60D Hoʻohui: 900

    HS70:800
    HS70L: 950
    HS70XL: 1100

    900

    1000

    Nā koho kiʻekiʻe {Calibration Jig}, 1D 2D Barcode System, Closed Loop System