NPM-D3
NPM-D3 - PANASONIC Modular SMT Hoʻokomo Mīkini
Nā hiʻohiʻona
- Hoʻololi ʻia ka ʻōnaehana lawelawe papa maʻalahi no ke kākoʻo ʻana i nā ʻano hana hana ʻelua a ʻelua
- 2.Compact footprint a me ka lua-ʻaoʻao hana maximizes hale hana papahele hoʻohana a me ka scalability
- Hoʻohui ʻia ka pahupaʻi kiʻi hoʻonaʻauao lehulehu wale nō o ka ʻoihana e hoʻohui i ka alignment, mānoanoa a me ka coplanarity 3D i hoʻokahi kaʻina mālama manawa, hoʻomaikaʻi kaʻina.
| Hoʻohālike | NPM-D3 |
| Nui PCB (L×W) | Pālua: L50×W50~L510×W300 |
|
| Hoʻokahi: L50×W50~L510×W590 |
| Ka pololei o ke kau ʻana | H16: 0402, 0603, 1005 Hoʻokomo ±0.04 mm*1 : Cpk≧103015 ※2, 0402, 0603, 1005 kau ± 0.03 mm*3 : Cpk≧1 |
| H12/08: 0402, 0603, 1005 Hoʻokomo ± 0.03 mm: Cpk≧1 | |
| Ka hiki | H16: 84,000 CPH * 1 (ʻoki: 0.043s / chip); 76,000 CPH*2 (ʻoki puʻupuʻu 0.047s/ʻumeke) |
| H12: 69 000 CPH (pili: 0.052 s/ chip) | |
| H08: 43 000 CPH (pili: 0.084 s/ chip) | |
| H02: 11 000 CPH (chip: 0.327 s/chip); 8 500 CPH(QFP: 0.423 s/ chip) | |
| Nā hōʻailona mea | H16: 03015 ~ 6 × 6 mm Kiʻekiʻe: Max 3.0mm |
| H12: 0402~12 × 12 mm Kiʻekiʻe: Max 6.5mm | |
| H08 : 0402~32 × 32 mm Kiʻekiʻe: Max 12mm | |
| H02 : 0603~100 × 90 mm mm Kiʻekiʻe: Max 28mm | |
| Nui mīkini | ・W 832 × D 2 683 × H 1 444 mm (ke hoʻopili ʻia me kahi mea hānai pā) ・W 832 × D 2 729 × H 1 444 mm (ke hoʻopili ʻia me kahi mea hoʻololi kaʻa) |
| kaumaha mīkini | ・ Ke kino nui 1680 kg; ・ Mea hānai pā: 200kg ・ Kaʻa hoʻololi: 110kg; ・ PAHU KUKU: 70 kg |