HS60- PARMI 3D SPI Solder Paste Tshuaj Xyuas Tshuab Siv
Specifications | ||||||
SPI Series | HS 60 Series | HS 70 Series | HS 70 DH | |||
3D Lub Koob Yees Duab | Lub taub hau Sensor | RSC5 | (Supreme) RSC6-HS | RSC6-HS | RSC6-HR | RSC6-HSx2 |
| Scan ceev (sq.cm/sec) | 60 | 100 | 100 | 80 | 100 |
| X, Y daws teeb meem (um) | 18 x18 | 13 x13 | 13 x13 | 10 x 10 | 13 x13 |
| Lateral Ntev (mm) | nees nkaum peb | 32 | 32 | nees nkaum ob | 32 |
| Qhov siab daws teeb meem (um) | 0.2 | 0.2 | 02 ib | 0.1 | 02 ib |
Kev ua tau zoo | Rov ua dua | 3 Sigma ib | 3 Sigma ib | 3 Sigma ib | 3 Sigma ib | 3 Sigma ib |
| Qhov tseeb (um / qhov siab) | 2 | 2 | 2 | 2 | 2 |
| Gage R&R |
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Kev ntsuas | Min.Solder Paste Size (um) | 200 × 200 | 150 x 150 | 150 x 150 | 100 x 100 | 150 x 150 |
| Max.Solder Paste Loj (ib qho) | 20 x 20 | 20 × 20 | 20 × 20 | 20 × 20 | 20 x 20 |
| Min.Solder Paste Pitch (ib qho) | 100 | 100 | 100 | 8 0 awm | 100 |
| Max.Solder Paste Qhov siab (ib qho) | 1000 um | ||||
| Ntsuas ntsuas | Qhov siab, Cheeb Tsam, ntim, Offset, Choj, Zoo, Warpage, PCB shrink | Qhov siab, Cheeb Tsam, ntim, Offset, Choj, Zoo, Warpage, PCB shrink | Qhov siab, Cheeb Tsam, ntim, Offset, Choj, Zoo, Warpage, PCB shrink | Qhov siab, Cheeb Tsam, ntim, Offset, Choj, Zoo, Warpage, PCB shrink | Qhov siab, Cheeb Tsam, ntim, Offset, Choj, Zoo, Warpage, PCB shrink |
| PCB Warpage | ± 5 hli (2%) | ± 5 hli (2%) | ± 5 hli (2%) | ± 5 hli (2%) | ± 5 hli (2%) |
Board | Qhov Loj (L * W) | H860,60L: 50 × 50 | HS60, 60L Supreme.50 × 50 | HS70: 80 × 80 | 80 × 80 | 80 × 80 |
| Max Loj | HS60: 360 × 260 | HS60 Loj: 340x260 | HS70D: 420 × 350 | HS70D: 340 × 315 | 350 × 250 hli |
| Thickness | 0.4mm mus rau 4mm | ||||
| TOP/Kab | HH60: 25/25 | HS60 Qhov Loj: 25/25 | 0 | 4/23 | 4/20 |
| TOP/Kab | HS60, 60L, 60XL: 2.5/3.5 | HS60, 60L, 60XL siab: 2.5 / 3.5 | HS70, 70L: 2.5 / 3.5 hli | HS70D, 70DL: 2.5/3.5 | 2.5/4.0 |
| PCB Nyhav (kg) | hwv 60:2 | ib 70:2 | 1.5 | ||
Khoos phis tawj & | CPU | Intel i3-2100 (3.1G) | Intel i3-2100 (3.1G) | Intel i3-2100 (3.1G) | Intel i3-2100 (3.1G) | Intel i3-2100 (3.1G) |
| Nco (GB) | HH60, HH60L: 8 | 8 | ib 70:8 | 16 | 8 |
| Saib xyuas | 20 * Dav | ||||
| Kev Ua Haujlwm | MS-Windows XP Professional 64-ntsis / Qhov rai 7 | ||||
Kev siv hluav taws xob | Lub zog (kw) | AC 220V (50 / 60Hz, 1 Phase) | ||||
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| 60: 1.5 TSI | 2.3 | 70:1.7 ib | 2.3 | 3.5 |
| Cua | 5 Kgf/m² | ||||
Qhov system | Dimension | HS60: 900x1000xl480 | HS60 Supereme: 900x1000x1480 | HS70: 970x1195x1535 | HS70D 1: 920x1415x1510 | 1296x1980x1510 |
| Qhov hnyav (kg) | ib 60:750 | HS60 Supereme: 750 | 70: 800 : Hwv | 900 | 1000 |
Options Height Gauge {Calibration Jig}, 1D 2D Barcode System, Kaw Loop System |