GKG GT++ A na-eji ngwa nbipute tapawa akpaaka akpaaka / ọhụrụ

1. Ụdị karama akpaka tinning na solder nchọpụta nchọpụta

Mobile akpaka solder tapawa mgbakwunye iji hụ na solder mado àgwà na solder mado ego na nchara ntupu, si otú huu ahịa obibi akwụkwọ àgwà na imeziwanye arụpụtaghị ihe.

2. Sistemụ nkesa gluu akpaaka

Dị ka dị iche iche na-ebi akwụkwọ usoro chọrọ, mgbe ebi akwụkwọ, PCB osisi nwere ike n'ụzọ ziri ezi ekesa, tinned, akara sere, jupụtara na ndị ọzọ ọrụ; N'otu oge ahụ, isi ihe na-ekesa gluu na-ejikwa ọrụ kpo oku, nke nwere ike kpoo gluu mgbe okpomọkụ dị n'ime ala dị ala iji meziwanye mmiri nke gluu.

3. Njikọ SPI

Ejikọtara ya na SPI iji mepụta sistemụ mechiri emechi. Mgbe ị na-anata ozi nzaghachi gbasara mbipụta na-adịghị mma site na SPI, igwe ga-agbanwe ozugbo dịka nkwụghachi nzaghachi SPI siri dị. Enwere ike imezi nkwụsịtụ ntụzịaka XY na-akpaghị aka n'ime 3PCS, a ga-ehichapụkwa nchara nchara iji melite ogo mbipụta na mmepụta mmepụta, na-eme usoro nzaghachi mbipụta akwụkwọ zuru oke.

4. Ọrụ nchọpụta nchara ígwè

Site n'ịrụ ụgwọ ọkụ ọkụ n'elu nchara nchara, na-eji CCD na-elele ntupu nke nchara nchara ozugbo, ọ nwere ike chọpụta ngwa ngwa ma chọpụta ma a na-egbochi nchara nchara ahụ ka ehichapụchara, wee kpochaa ya ozugbo, nke bụ mgbakwunye na nchara nchara. Nchọpụta 2D nke bọọdụ PCB.

5. Na-eduga ndakọrịta nke ụlọ ọrụ 4.0

Site na-ebugote ma ọ bụ wepụta ọkwa igwe na akpaghị aka, ọ na-enye nkwa siri ike maka nrụpụta ọgụgụ isi nke Industrylọ ọrụ 4.0 maka ndị ahịa. Ọ nwere ike nweta docking enweghị nkebi na usoro MES nke ndị ahịa wee nweta nnukwu traceability nke ngwaahịa; jiri ọgụgụ isi na-ejikwa nleba anya akụrụngwa, ma ghọta oke nke ikike ojiji maka ndị injinia na ọkwa niile dịka njikwa saịtị.

6. BTB

Ugboro abụọ na-eweta arụmọrụ ugboro abụọ: enwere ike ịchịkwa ngwaọrụ abụọ ahụ iche iche, dịka ọmụmaatụ na-agba ọsọ ngwaahịa dị iche iche na egwu ọ bụla; Enwere ike kewaa ngwaọrụ abụọ ahụ ọzọ n'oge ọ bụla.