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HS60- PARMI 3D SPI Solder Mesin Inspeksi Tempel Digunakake

HS60

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Produk Unggulan

HS60- PARMI 3D SPI Solder Mesin Inspeksi Tempel Digunakake

Katrangan

PARMI SPI HS60 nampilake sawetara teknologi canggih, kalebu visi SMT cerdas, teknologi place-and-test (PnT), lan pakan robot cerdas. Iki dilengkapi karo telung set nozzles, loro digunakake kanggo SMT nozzle soyo tambah lan siji kanggo registrasi sesanti. Sistem kasebut dilengkapi kepala laser fokus otomatis kanggo akurasi registrasi pin sing optimal.

Aset SPI HS60 bisa ngasilake volume dhuwur, kanthi ukuran papan maksimal 10' x 10'. Iki minangka mesin sing serbaguna, bisa ngolah macem-macem bagean, kayata BGA lan CSP, uga solder tanpa timbal. Kajaba iku, fitur modul chip sing dioptimalake, sing ngidini pemasangan chip kanthi kacepetan dhuwur. Kemampuan iki, bebarengan karo fitur-fitur liyane, ndadekake model iki sampurna kanggo perakitan PCB lan tugas manufaktur kanggo proyek cilik nganti medium.

    Spesifikasi

    SPI Seri

    HS60 Seri

    HS70 Seri

    HS70DH

    Kamera 3D

    Kepala Sensor Kab

    RSC5

    (Sing paling dhuwur) RSC6-HS

    RSC6-HS

    RSC6-HR

    RSC6-HSx2

     

    Kacepetan Scan (sq.cm/sec)

    60

    100

    100

    80

    100

     

    Resolusi X, Y (um)

    18x18

    13x13

    13x13

    10x10

    13x13

     

    Length Lateral (mm)

    telulikur

    32

    32

    rong puluh loro

    32

     

    Resolusi dhuwur (um)

    0.2

    0.2

    02

    0.1

    02

    Kinerja

    Repeatability

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

    3 Sigma
    3Sigma
    3Sigma

     

    Akurasi (um/Dhuwur)

    2

    2

    2

    2

    2

     

    Gage R&R

    Pangukuran

    Min. Ukuran Tempel Solder (um)

    200×200

    150x150

    150x150

    100x100

    150x150

     

    Max.Solder Paste Ukuran (siji)

    20x20

    20×20

    20×20

    20×20

    20x20

     

    Min.Solder Paste Pitch (siji)

    100

    100

    100

    80um

    100

     

    Max.Solder Tempel Dhuwur (siji)

    1000um

     

    Pengukuran l

    Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

    Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink

     

    PCB Warpage

    ± 5mm (2%)

    ± 5mm (2%)

    ± 5mm (2%)

    ± 5mm (2%)

    ± 5mm (2%)

    Papan
    Dmension

    Ukuran Min (L * W)

    H860,60L: 50×50
    H860D: 80×80
    HS60XL, 60XXL: 100x100

    HS60, 60L Supreme.50×50
    HS60D Plus.8DX80
    HS60XL Supreme: 100x100

    HS70: 80×80
    HS70L, HS70XL: 100x100

    80×80

    80×80

     

    Ukuran Max
    (L*W)

    HS60: 360×260
    HS60L: 520×510
    HS60XL: 700×510
    HS60XXL: 880X510
    HS60D: 340×315

    HS60 Supreme: 340x260
    HS60L Supreme: 500x510
    HS60XL Ukuran: 685x510
    HS60D Plus: 350x315

    HS70D: 420×350
    HS70L: 590×610
    HS70XL: 950×670

    HS70D: 340×315
    HS70DL: 590×610

    350×250

     

    kekandelan

    0.4mm nganti 4mm

     

    Ndhuwur / Ngisor
    Clearance
    (mm/mm)

    HS60: 25/25
    HS60L, 60XL, 60XXL: 18/25
    HS60d: 4/23

    HS60 Supreme: 25/25
    HS60L, 60XL. Paling dhuwur: 25/25
    HS60D Plus: 4/23

    0

    4/23

    4/20

     

    Ndhuwur / Ngisor
    Edge Clearance
    (mm/mm)

    HS60, 60L, 60XL: 2.5/3.5
    HS60XXL: 3.5/4.5
    HS60D: 25/3.5

    HS60, 60L, 60XL Supreme: 2.5/3.5
    HS60D Plus: 2.5 / 3.5

    HS70, 70L: 2.5/3.5
    HS70XL: 3.5/5.0

    HS70D, 70DL: 2.5/3.5

    2.5/4.0

     

    Bobot PCB (kg)

    HS60: 2
    HS60L, 60XL, 60XXL: 4
    HS60D: 1.5

    HS70: 2
    HS70L,70XL: 10
    HS70D: 1.5
    H870DL: 3

    1.5

    Komputer&
    Konsol

    CPU

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

    Intel i3-2100(3.1G)

     

    Memori (GB)

    HS60, HS60L: 8
    HS60XL, HS60XXL: 16

    8

    HS70: 8
    HS70L: 16
    HS70XL: 48

    16

    8

     

    Ngawasi

    20 * Jembar

     

    Sistem Operasi

    MS-Windows XP Professional 64bit/Window 7

    Utilitas

    Daya (kw)

    AC 220V (50/60Hz, 1 Phase)

     

     

    HS60:1.5
    HS60L, H60XL, HS60XXL: 1.8

    2.3

    HS70: 1.7
    HS70L: 1.8
    HS70XL: 2.0

    2.3

    3.5

     

    hawa

    5 Kgf/sq.cm

    Sistem
    ukuran

    ukuran
    (W * D * H) mm

    HS60: 900x1000xl480
    HS60L: 1060x1285x1480
    HS60XL: 1240x1285x1430
    HS60XXL: 1420×1285×1480
    HS60D: 1180x1395x1480

    HS60 Supereme: 900x1000x1480
    HS60L Supereme: 1060x1285x1450
    HS60XL Supereme: 1240x1285x1480
    HS60D Plus: 1180x1435x1450

    HS70: 970x1195x1535
    HS70L: 1170x1335x1535
    HS70XL: 1530x1415x1535

    HS70D 1:920x1415x1510
    HS70D 3:1180x1475x1510

    1296x1980x1510

     

    Bobot (kg)

    HS60: 750
    HS60L, 60XL, 60XXL: 1000
    HS60D: 900

    HS60 Supereme: 750
    HS60L, 60XL, 60XXL Supereme: 1000
    HS60D Plus: 900

    HS70:800
    HS70L: 950
    HS70XL: 1100

    900

    1000

    Pilihan Gauge Dhuwur {Calibration Jig}, Sistem Barcode 1D 2D, Sistem Loop Tertutup