HS60- PARMI 3D SPI Solder Mesin Inspeksi Tempel Digunakake
Spesifikasi | ||||||
SPI Seri | HS60 Seri | HS70 Seri | HS70DH | |||
Kamera 3D | Kepala Sensor Kab | RSC5 | (Sing paling dhuwur) RSC6-HS | RSC6-HS | RSC6-HR | RSC6-HSx2 |
| Kacepetan Scan (sq.cm/sec) | 60 | 100 | 100 | 80 | 100 |
| Resolusi X, Y (um) | 18x18 | 13x13 | 13x13 | 10x10 | 13x13 |
| Length Lateral (mm) | telulikur | 32 | 32 | rong puluh loro | 32 |
| Resolusi dhuwur (um) | 0.2 | 0.2 | 02 | 0.1 | 02 |
Kinerja | Repeatability | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma |
| Akurasi (um/Dhuwur) | 2 | 2 | 2 | 2 | 2 |
| Gage R&R |
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Pangukuran | Min. Ukuran Tempel Solder (um) | 200×200 | 150x150 | 150x150 | 100x100 | 150x150 |
| Max.Solder Paste Ukuran (siji) | 20x20 | 20×20 | 20×20 | 20×20 | 20x20 |
| Min.Solder Paste Pitch (siji) | 100 | 100 | 100 | 80um | 100 |
| Max.Solder Tempel Dhuwur (siji) | 1000um | ||||
| Pengukuran l | Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | Dhuwur, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink |
| PCB Warpage | ± 5mm (2%) | ± 5mm (2%) | ± 5mm (2%) | ± 5mm (2%) | ± 5mm (2%) |
Papan | Ukuran Min (L * W) | H860,60L: 50×50 | HS60, 60L Supreme.50×50 | HS70: 80×80 | 80×80 | 80×80 |
| Ukuran Max | HS60: 360×260 | HS60 Supreme: 340x260 | HS70D: 420×350 | HS70D: 340×315 | 350×250 |
| kekandelan | 0.4mm nganti 4mm | ||||
| Ndhuwur / Ngisor | HS60: 25/25 | HS60 Supreme: 25/25 | 0 | 4/23 | 4/20 |
| Ndhuwur / Ngisor | HS60, 60L, 60XL: 2.5/3.5 | HS60, 60L, 60XL Supreme: 2.5/3.5 | HS70, 70L: 2.5/3.5 | HS70D, 70DL: 2.5/3.5 | 2.5/4.0 |
| Bobot PCB (kg) | HS60: 2 | HS70: 2 | 1.5 | ||
Komputer& | CPU | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) | Intel i3-2100(3.1G) |
| Memori (GB) | HS60, HS60L: 8 | 8 | HS70: 8 | 16 | 8 |
| Ngawasi | 20 * Jembar | ||||
| Sistem Operasi | MS-Windows XP Professional 64bit/Window 7 | ||||
Utilitas | Daya (kw) | AC 220V (50/60Hz, 1 Phase) | ||||
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| HS60:1.5 | 2.3 | HS70: 1.7 | 2.3 | 3.5 |
| hawa | 5 Kgf/sq.cm | ||||
Sistem | ukuran | HS60: 900x1000xl480 | HS60 Supereme: 900x1000x1480 | HS70: 970x1195x1535 | HS70D 1:920x1415x1510 | 1296x1980x1510 |
| Bobot (kg) | HS60: 750 | HS60 Supereme: 750 | HS70:800 | 900 | 1000 |
Pilihan Gauge Dhuwur {Calibration Jig}, Sistem Barcode 1D 2D, Sistem Loop Tertutup |