Semi-automatic Splitting Machine

After connecting multiple boards after soldering, breakage will often damage the circuit or break the electronic parts. This machine cuts through the cutting motion, which can completely reduce stress, prevent cracks in solder joints and breakage of parts, and improve production efficiency and quality. Using the method of upper circular knife and lower flat knife, the board is placed on the lower flat knife. When the switch is stepped on, the upper circular knife moves laterally to the set fixed point, which will cut off the PCB board. The upper circular knife cuts without stripping, and the cut is smooth and seamless. rough edges.

This equipment uses multiple sets of knives to perform multiple cutting tasks at the same time to improve production efficiency.

This equipment uses 2 sets of upper and lower blades for cutting tasks.

Adopting the latest pneumatic and lightweight design, it can complete the shear stress-free cutting stroke in one go, especially suitable for cutting precision SMD or thin plates. There are no BOW WAVES and MICRO CRACKs produced during circular knife debonding. Use wedge-shaped cutters to linearly deboard, minimizing shear stress so that sensitive SMD components and even capacitors are not affected. Potential product quality risks are minimized. The cutting stroke is less than 1-2MM, so there are no concerns about operational safety. The tool is made of high-speed steel and precision ground and can be ground and used repeatedly. It is also suitable for thin plate splitting operations without V-CUT.