E by DEK - ASM Inline Solder Namira Printer
Features
E-Quality
DEK vane ruzivo rwekuprinda vakagadzira chikuva cheE neDEK chine zvemhando yepamusoro-soro, kuvaka kwakaomarara, uye modular dhizaini inovimbisa yakagadzikana uye yakavimbika dhizaini kunyangwe kune ichangoburwa-pitch application.
E-Performance
Iyo E neDEK inopa E-Performance ne:
8 seconds core cycle time
Fast setup changeovers
High repeatability
Nenguva pfupi pfupi yekutenderera uye nekukurumidza chigadzirwa chekuchinja chakapetwa nehupamhi hwekudzokorora kunyatsoita, iyo E neDEK inoisa mitsva muchikamu chepakati-kumhanya.
E-Facts
Yakanyatso kurongeka, uye nhamba yega yega inopa nharo yakasimba: Izvo zvakanyanya kukosha uye manhamba paE neDEK.
* Alignment qualifications inosanganisira bhodhi kurodha / kurodha, bhodhi clamping, kamera / tafura kufamba. Kugona kukosha kunoverengerwa nechitatu-bato QC-Calc software.
# Kugona kwemuchina kunosanganisira kurodha / kurodha, bhodhi clamping, kamera / kusimuka kwetafura kufamba uye kudhinda maitiro. Iko kukosha kwekugona kunoverengerwa nechitatu-bato QC-Calc software.
E By DEK
Kuchinjika pazvakanakisa!
Imwe neimwe fekitori yeSMT ine yayo yakakosha matambudziko. Ndosaka takagadzira Sarudzo dzeE neDEK dzinobvumira kurongedza kwetsika nemamodule akanyatso kurongeka ekudhinda mhinduro izvo zvinozoita kuti vatengi vako vafare uye kusimudza kugadzirwa kwako kweSMT kusvika padanho idzva.
E neDEK Sarudzo dzezvese zvikumbiro zvako:
throughput
Hunhu
Kuchinja-chinja
Mapuranga akareba uye anorema edunhu
Alignment | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
Sistimu alignment kugona | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
Optimum musimboti kutenderera nguva | 8 seconds |
Substrate size | 50 mm (X) x 40.5 mm (Y) kusvika 620 mm (X) x 508.5 mm (Y) |
Operating System | Windows 7 Yakaiswa |
Squeegee pressure mechanism | Software-inodzorwa, mota ine yakavharwa loop mhinduro |
Stencil positioning | Semi-auto stencil load ine drip tray |
Understencil kuchenesa | Inochinjika understencil cleaner (IUSC), inorongeka zvizere nekunyorova/kuoma/vacuum kupukuta |
Inogadziriswa-yakafara stencil gomo (AWSM) | Misiyano yeframe - inogadzirika zvizere kuti igare saizi yefuremu muhupamhi hwe381 mm kusvika 736 mm |
Substrate ukobvu | 0.2 kusvika 6 mm |
Substrate uremu (yakanyanya) | 6 kg |
Substrate warpage | Kusvika 7mm kusanganisira substrate ukobvu |
Chigadzirwa che substrate | Pamusoro pepamusoro clamp Edge clamp Foil-isina clamp Vacuum |
Tembiricha & humidity sensor | Kuongororwa kwemamiriro ekugadzirisa |