NPM-D3
NPM-D3 - PANASONIC Modular SMT Placement Machine
Likaroloana
- Sistimi ea ho sebetsana le boto e feto-fetohang e fetolela ho ts'ehetsa mekhoa e le 'ngoe le e mengata ea ts'ebetso ea litsela tse peli
- 2. Compact footprint le ts'ebetso ea mahlakore a mabeli e eketsa tšebeliso ea sebaka sa fektheri le scalability
- E kopanya kh'amera e le 'ngoe feela ea indasteri e tsebahalang e nang le mekhoa e mengata e kopanyang ho hokahanya, botenya le 3D coplanarity ho mohato o le mong oa ho boloka nako, oa ho ntlafatsa ts'ebetso.
| Mohlala | NPM-D3 |
| Boholo ba PCB (L×W) | Habeli: L50×W50~L510×W300 |
|
| E le 'ngoe: L50×W50~L510×W590 |
| Ho nepahala ha ho beoa | H16: 0402, 0603, 1005 Ho beoa ± 0.04 limilimithara * 1 : Cpk≧103015 ※2, 0402, 0603, 1005 ho behoa ± 0.03 mm * 3 : Cpk≧1 |
| H12/08: 0402, 0603, 1005 Ho beoa ± 0.03 limilimithara: Cpk≧1 | |
| Bokhoni | H16: 84,000 CPH * 1 (chip: 0.043s / chip); 76,000 CPH*2 (chip 0.047s/chip) |
| H12: 69 000 CPH (chip: 0.052 s/chip) | |
| H08: 43 000 CPH (chip: 0.084 s/chip) | |
| H02: 11 000 CPH (chip: 0.327 s/chip); 8 500 CPH(QFP: 0.423 s/chip) | |
| Matšoao a ntho | H16: 03015 ~ 6 × 6 limilimithara Bophahamo: Max 3.0mm |
| H12: 0402 ~ 12 × 12 limilimithara Bophahamo: Max 6.5mm | |
| H08 : 0402~32 × 32 limilimithara Bophahamo: Max 12mm | |
| H02 : 0603~100 × 90 mm Bophahamo: Max 28mm | |
| Boholo ba mochini | ・ W 832 × D 2 683 × H 1 444 limilimithara (ha e hokahantsoe le sefepi sa terei) ・ W 832 × D 2 729 × H 1 444 limilimithara (ha e hokahantsoe le mochini o fetolang teroli) |
| Boima ba mochini | 'Mele o moholo oa 1680 lik'hilograma; ・ Sefepi sa terei: 200kg Teroli ea phapanyetsano: 110kg; ・ Sheba LEbokose: 70 kg |