Lihlahisoa

Ho amohela moralo oa morao-rao oa moea le o bobebe, o ka phethela sekhahla se se nang khatello ea maikutlo ka nako e le 'ngoe, haholo-holo se loketseng ho seha SMD kapa lipoleiti tse tšesaane. Ha ho na BOW WAVES le MICRO CRACKs tse hlahisoang nakong ea ho koala thipa e chitja. Sebelisa li-cutters tse bōpehileng joaloka lekhalo ho theola ka mokhoa o hlakileng, ho fokotsa khatello ea sekiri e le hore likarolo tse hlokolosi tsa SMD esita le li-capacitor li se ke tsa ameha. Likotsi tse ka bang teng tsa boleng ba sehlahisoa lia fokotseha. Leqeba la ho itšeha le tlase ho 1-2MM, kahoo ha ho na matšoenyeho mabapi le polokeho ea ts'ebetso. Sesebelisoa sena se entsoe ka tšepe ea lebelo le holimo le fatše e nepahetseng 'me e ka siloa le ho sebelisoa khafetsa. E boetse e loketse ts'ebetso ea ho arola poleiti e tšesaane ntle le V-CUT.

A splitter ka ho feletseng ke sesebelisoa se sebelisetsoang ho arola li-PCB 'me hangata se sebelisoa meleng ea tlhahiso. E ka khaola le ho arola li-PCB tse kholo ho li-PCB tse nyane tsa boholo bo hlokahalang, ea ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo tsa basebetsi.

Tlhaloso

PARMI SPI HS60 e na le mefuta e mengata ea mahlale a tsoetseng pele, ho kenyelletsa le pono e bohlale ea SMT, theknoloji ea sebaka le tlhahlobo (PnT), le phepelo ea liroboto tse bohlale. E na le lihlopha tse tharo tsa li-nozzles, tse peli tsa tsona li sebelisetsoa ho kenya li-nozzle tsa SMT le e 'ngoe bakeng sa ngoliso ea pono. Sistimi e na le hlooho ea laser ea auto-focus bakeng sa ho nepahala ho nepahetseng ho ngolisoa ha phini.

Letlotlo la SPI HS60 le khona ho hlahisa palo e phahameng, ka boholo ba boto ea 10' x 10'. Ke mochini o feto-fetohang haholo, o khonang ho sebetsana le likarolo tse fapaneng, joalo ka BGA le CSPs, hammoho le li-solders tse se nang loto. Ntle le moo, e na le mochini o ntlafalitsoeng oa chip, o lumellang ho hlongoa ha chip ka lebelo le holimo. Bokhoni bona, hammoho le likarolo tse ling tsa bona, bo etsa hore mohlala ona o phethahale bakeng sa kopano ea PCB le mesebetsi ea tlhahiso bakeng sa merero e menyenyane ho isa ho e mahareng.

Tlhaloso
3D AOI Sensor Head (TRSC-I)
• Khamera ea CMOS ea Lebelo le Phahameng (4Mega-pixel) e nang le Dual Laser Technology
• Mabone a LED a RGB
• Lense ea Telecentric
• Boima ba Leseli, Moqapi oa Hlooho ea Sensor Compact
• Lebelo la Tlhahlobo e Eteletseng Pele ea Indasteri: 65 cm2/sec @ 14 x 14um
• Nako ea ho potoloha: Bakeng sa PCB 260mm x 200mm = metsotsoana e 10 ho kenyeletsa mojaro le ho laolla

INLINE XC-3100 e sebelisoa haholo-holo bakeng sa ho bala ka potlako lisebelisoa tsa reel indastering ea SMT.

O ka odara mefuta e felletseng ea lisebelisoa tse kang 7-15 inch Tape Reel/JEDEC Tray/IC mekotla e hlokomelang mongobo. Mefuta ea thepa e kenyelletsa lisebelisoa tsohle tsa ho hanyetsa le tsa capacitance le lisebelisoa tsa IC. Theknoloji ea litšoantšo tsa X-ray e sebelisetsoa ho lemoha lisebelisoa tsa tlhahiso ka ho feletseng, ho fumana boitsebiso ba setšoantšo bakeng sa ho bala ka potlako, le ho hokahanya le ho boloka boitsebiso ka tsamaiso.

The rack thepa e bohlale ke thepa ea morao-rao ea polokelo e etselitsoeng ho laola thepa e sebetsang hantle le e hlophisehileng. E sebelisa theknoloji e tsoetseng pele ea ho lemoha le theknoloji ea IoT ho lekola lethathamo la thepa le sebaka ka nako ea nnete, ho ntlafatsa ho nepahala le katleho ea taolo ea thepa.

The rack thepa e bohlale ke thepa ea morao-rao ea polokelo e etselitsoeng ho laola thepa e sebetsang hantle le e hlophisehileng. E sebelisa theknoloji e tsoetseng pele ea ho lemoha le theknoloji ea IoT ho lekola lethathamo la thepa le sebaka ka nako ea nnete, ho ntlafatsa ho nepahala le katleho ea taolo ea thepa.

Thepa ena e sebelisetsoa ho sebetsa boto e ka holimo kapa boto e tlase ea boto ea potoloho ea boto ea potoloho moleng oa tlhahiso ea SMT.

Stack pcb bare boto holim'a foreimi ea lintho tse bonahalang, 'me joale ka tsela e iketsang e romela ho thepa pina ea SMT mounter.

Automatic board sucker e sebelisoa bakeng sa ts'ebetso ea othomathike ea ho kenya boto ea liboto tse mahlakoreng a mabeli le liboto tsa optical meleng ea tlhahiso ea SMT. Mokhoa o khethehileng oa alloy alloy bakeng sa kutloisiso e hlakileng ea boemo ba ts'ebetso ea MAGAZINE. Moqapi o tsitsitseng oa ho phahamisa tafole e le 'ngoe o ntlafatsa botsitso ba lisebelisoa. Mofuta oa boemo ba lintlha tse tharo holimo le tlase oa pneumatic tightening e amoheloa ho netefatsa boemo bo nepahetseng ba lebokose la thepa. Taolo ea lebelo le ka feto-fetohang la push plate.

Thepa e fanang ka liboto tse se nang letho tsa PCB tseleng ea mohala oa patch oa SMT. Mehala ea tlhahiso e nang le litlhoko tse tlase tsa automation e ka nkeloa sebaka ka letsoho.

Sesebelisoa sena se sebelisetsoa ho sebetsa boto e ka holimo kapa boto e tlase ea boto ea potoloho moleng oa tlhahiso ea SMT.