GT++
I-GKG GT++ Isishicileli Sokuncamathisela se-Solder esiSebenzayo esiSetyenzisiweyo / Esitsha
Iintshayelelo
- Inkqubo yokucoca ithontsi
Isakhiwo sokucoca i-Drip sithintela ngokufanelekileyo i-tube ye-solvent ekuvimbeleni umngxuma kwaye ibangele ukusula kwe-solvent-free kunye nokungahlambuluki kwendawo.
- Uyilo olutsha lwesakhiwo se-scraper
Isakhiwo esitsha se-scraper somzila wesilayidi kunye ne-cylinder siphucula ukuzinza komsebenzi kunye nokwandisa ubomi benkonzo.
- Inkqubo yokubeka umzila kaloliwe
Ipatent yokuyila imodeli yosetyenziso lwamazwe ngamazwe. Isixhobo esibambekayo esisecaleni esinokususwa kunye nesilungelelanisiweyo senza ukucaba okuphezulu okukodwa kwiibhodi ezithambileyo kunye neePCB ezijijekileyo. Inokurhoxiswa ngokuzenzekelayo ngeprogram yesoftware ngaphandle kokuchaphazela ubukhulu betoti.
- Inkqubo yekhamera yedijithali yeCCD
I-brand entsha ye-optical path system-uniform annular light kunye nokukhanya okuphezulu kwe-coaxial, kunye nokukhanya okungenakulinganiswa okuguquguqukayo, kwenza zonke iintlobo zeempawu zeMarko zichongwe kakuhle (kubandakanywa namanqaku angalinganiyo aMakisha) ukuqhelanisa ne-tin-plated, copper-plated. , igolide-efakwe kwi-tin-sprayed, i-FPC kunye nezinye iintlobo ze-PCB ezinemibala eyahlukeneyo.
- Ukuchaneka okuphezulu kweqonga lokunyuswa kobunzima bePCB
Isakhiwo esibambeneyo nesithembekileyo, ukuphakanyiswa okuzinzileyo kunye nokwehliswa, i-PIN yokuphakama kwesoftware uhlengahlengiso oluzenzekelayo, inokulungelelanisa ngokuchanekileyo ubude bendawo yeebhodi zePCB zobunzima obahlukeneyo.
- Ujongano olutsha olunemisebenzi emininzi
Ilula kwaye icacile, kulula ukuyisebenzisa. Umsebenzi wokulawula ubushushu bexesha langempela.
- Uhlobo lwebhotile oluzenzekelayo lwetoni kunye nomsebenzi wokubona uncamathiselo lwe-solder
Iselfowuni ezenzekelayo yokuncamathisela yokudibanisa ukuqinisekisa umgangatho we-solder paste kunye nesixa se-solder paste kwi-mesh yentsimbi, ngaloo ndlela iqinisekisa umgangatho wokuprinta umthengi kunye nokuphucula imveliso.
- Inkqubo yokukhupha iglu ezenzekelayo
Ngokweemfuno ezahlukeneyo zenkqubo yoshicilelo, emva kokushicilela, ibhodi ye-PCB inokuchithwa ngokuchanekileyo, ifakwe, ifakwe umgca, izaliswe kunye neminye imisebenzi; ngelo xesha, intloko yokukhupha iglue nayo ixhotyiswe ngomsebenzi wokufudumeza, onokutshisa iglue xa ubushushu be-ambient buphantsi ukuphucula ubuninzi beglue.
- Uqhagamshelwano lweSPI
Idityaniswe neSPI ukwenza inkqubo evaliweyo. Xa ufumana ulwazi lwengxelo malunga noshicilelo olubi oluvela kwi-SPI, umatshini uya kulungelelanisa ngokuzenzekelayo ngokwe-SPI feedback offset. I-XY direction offset inokulungiswa ngokuzenzekelayo ngaphakathi kwe-3PCS, kwaye i-mesh yensimbi iya kucocwa ukuphucula umgangatho wokushicilela kunye nokusebenza kakuhle kwemveliso, ukwenza inkqubo epheleleyo yokushicilela.
- Umsebenzi wokubona umnatha wentsimbi
Ngokwenza imbuyekezo yomthombo wokukhanya ngaphezu kwe-mesh yensimbi, usebenzisa i-CCD ukujonga i-mesh ye-mesh yensimbi ngexesha langempela, inokubona ngokukhawuleza kwaye inqume ukuba i-mesh yensimbi ivaliwe emva kokucoca, kwaye ihlambulule ngokuzenzekelayo, eyongezelelweyo kwi-mesh. Ukufunyanwa kwe-2D yebhodi yePCB.
- Ukukhokela ukuhambelana koShishino 4.0
Ngokulayisha ngokuzenzekelayo okanye ngokukhupha ubume bomatshini kunye neeparamitha, inika iziqinisekiso eziqinileyo zokuveliswa okukrelekrele kweShishini 4.0 kubathengi. Inokufezekisa i-docking engenamthungo ngenkqubo ye-MES yomthengi kwaye ifezekise ukulandeleka okuphezulu kweemveliso; lawula ngobuchule ukugcinwa kwezixhobo, kwaye uqonde ukwabiwa kwamalungelo okusebenzisa iinjineli kuwo onke amanqanaba ngokolawulo lwendawo.
- I-BTB
Iingoma eziphindwe kabini zizisa kabini ukusebenza: izixhobo ezibini zingalawulwa ngokwahlukileyo, umzekelo uqhuba iimveliso ezahlukeneyo kumzila ngamnye; izixhobo ezibini zinokwahlulwa kwakhona nangaliphi na ixesha.
| Umzekelo | GT++ |
| Ubungakanani besakhelo sekhusi | 470×370-737×737mm |
| Ubungakanani besubstrate | 50×50—510×510mm |
| Ubukhulu be-substrate | 0.4-6mm |
| Ubunzima be-substrate | 5Kg |
| Umsantsa we-substrate edge | 2.5mm |
| Ukuphakama kokudluliselwa | 23mm |
| Ukuphakama kokudluliselwa | 900±40mm |
| Isantya sezothutho | 1500mm/S (MAX) Ulawulo lweSoftware (isantya esilungelelanisiweyo) |
| Indlela yokudlulisela | Inqanaba elinye likaloliwe wesikhokelo sothutho |
| Indlela yenkxaso ye-substrate | I-Magnetic ejector pin / ibhloko yobude obulinganayo / ukulungiswa okuzenzekelayo kweqonga lokuphakamisa |
| Indlela yokuqinisa i-substrate | Ipleyiti yoxinzelelo lweteleskopu ezenzekelayo/i-flexible clamping edge/vacuum adsorption function |
| Ukwakhiwa koshicilelo | 0-20mm |
| Imo yoshicilelo | Ukuprintwa kwe-scraper enye okanye kabini |
| Uhlobo lwe-scraper | I-Rubber scraper/i-steel scraper (i-engile 45°/55°/60°) |
| Isantya se-scraper | 6-200mm/umzuzwana |
| Uxinzelelo loshicilelo | 0.5-10Kg |
| Indlela yokucoca | Inkqubo yokucoca i-drip / ukuphindaphinda ukucoca / ukomisa kunye neendlela zokufunxa ezimanzi |
| Indawo yokujonga | 10 × 8mm |
| Uhlobo lwenqaku lesalathisi | Indawo yokukhangela esemgangathweni/iphedi/ukuvulwa |
| Uhlobo lwekhamera | Isixokelelwano esibonwayo esine-imaging phezulu nasezantsi/ikhamera yedijithali/indawo yokumatanisa yejometri |
| Ukuchaneka kokulungelelaniswa kwenkqubo kunye nokuphindaphinda | ±12.5um@6σ, CPK≥2.0 |
| Okwenyani solder intlama yokubekwa ukuphinda-phinda | ±18um@6σ, CPK≥2.0 |
| Umjikelo woshicilelo | ＜7.5 imizuzwana |
| Imfuno yamandla | AC220V±10%,50/60Hz,3KW |
| Imfuno yomoya oxinisiweyo | 4-6Kgf/cm² |
| Ukusetyenziswa komoya Malunga | 5L/min |
| Ubushushu bendawo yokusebenza | -20℃~﹢45℃ |
| Ukufuma kwendawo yokusebenza | 30%~60% |
| Imilinganiselo (ngaphandle kokukhanya okunemibala emithathu) | L1240×W1410×H1500 (mm) |
| Ubunzima | Malunga ne-1100Kg |