NPM-D3
NPM-D3 - PANASONIC Modular SMT Machine Placement
Iimbonakalo
- Inkqubo yokuphatha ibhodi eguquguqukayo iguqulela ukuxhasa iindlela ezisebenza ngeendlela ezimbini kunye nezininzi
- 2.Umkhondo obambeneyo kunye nokusebenza kwamacala amabini kwandisa ukusetyenziswa kwendawo yomgangatho wefektri kunye nokukaleka.
- Idibanisa ikhamera yolu shishino ikuphela kwebala-elinokwehla ekwaziwa ngeendlela ezininzi edibanisa ulungelelwaniso, ubukhulu kunye ne-3D coplanarity ibe yinto enye yokugcina ixesha, inkqubo yokuphucula inyathelo.
| Umzekelo | NPM-D3 |
| Ubungakanani bePCB (L×W) | Kabini: L50×W50~L510×W300 |
|
| Eyodwa: L50×W50~L510×W590 |
| Ukuchaneka kokubekwa | H16: 0402, 0603, 1005 Ukubekwa ±0.04 mm*1 : Cpk≧103015 ※2, 0402, 0603, Ukubekwa kwe-1005 ± 0.03 mm * 3: Cpk≧1 |
| H12/08: 0402, 0603, 1005 Ukubekwa ±0.03 mm: Cpk≧1 | |
| Umthamo | H16: 84,000 CPH * 1 (chip: 0.043s / chip); 76,000 CPH*2 (chip 0.047s/chip) |
| H12: 69 000 CPH (itshiphu: 0.052 s/chip) | |
| H08: 43 000 CPH (itshiphu: 0.084 s/chip) | |
| I-H02: 11 000 CPH (i-chip: 0.327 s / chip); 8 500 CPH(QFP: 0.423 s/chip) | |
| Iisimboli zento | H16: 03015 ~ 6 × 6 mm Ubude: Max 3.0mm |
| H12: 0402 ~ 12 × 12 mm Ubude: Max 6.5mm | |
| H08 : 0402~32 × 32 mm Ubude: Ubukhulu 12mm | |
| H02 : 0603~100 × 90 mm Ubude: Ubukhulu 28mm | |
| Ubungakanani bomatshini | ・ W 832 × D 2 683 × H 1 444 mm (xa uqhagamshelwe kwisiphakeli setreyi) ・ W 832 × D 2 729 × H 1 444 mm (xa uqhagamshelwe kwisitshintshi setroli) |
| Ubunzima bomatshini | Umzimba ophambili 1680 kg; ・ Isondlo setreyi: 200kg Itroli yokutshintshiselana: 110kg; ・ Jonga IBHOKISI: 70 kg |