Umshini Wokuthungatha we-PCB

Umshini wokuhlukanisa ozenzakalelayo ngokugcwele, obuye ubizwe ngokuthi umshini wokusika ibhodi lesifunda, usebenzisa umshini wokuphotha ojikelezayo onesivinini esikhulu ukushayela isisiki sokugaya ukuze usike. Ingakwazi ukusika ama-substrates anezingxenye ze-plug-in ezisondelene kakhulu, futhi isike amabhodi e-PCBA nezinye izinto ezincane ezenziwe ngezinye izinto ngokunembile nangesivinini esikhulu. Inqubo yokusebenza imi kanje. Faka ibhodi lesifunda bese ulibeka endaweni yokucubungula yokusika. Ngokunemba okuphezulu nokuphepha, i-spindle yesivinini esiphezulu iqinisekisa ukusika amabhodi wesifunda ngokucindezeleka okuncane kokusika; umklamo wezingxenyekazi ezimbili usebenza ngokuhlanganyela ukuze unciphise isikhathi sokulayisha nokulayisha futhi uthuthukise ukusebenza kahle kokukhiqiza. Isakhiwo esiyingqayizivele sokudonsa uthuli siqinisekisa ukuhlanzeka kwebhodi lesifunda. Ukumunca phezulu naphansi kuyinketho, kunikeza amakhasimende izinketho zezinhlelo zokusebenza ezinezici eziningi. Ukusebenza komshini kuwubuntu futhi kuhlakaniphile. Isizwa ikhamera ye-CCD, ukukopisha okuhlakaniphile, kanye ne-algorithm yokwenza indlela yokusika ukuze kuqinisekiswe ukunemba okuphezulu nokusebenza kahle komshini. Isistimu yokusebenza yewindi le-Windows 7 iphephile, izinzile, kulula ukuyifunda nokusebenzisa.

Ngemva kokuxhuma amabhodi amaningi ngemva kokuhlanganisa, ukuphuka kuzovame ukulimaza isifunda noma kuphule izingxenye ze-elekthronikhi. Lo mshini unqamula ukunyakaza kokusika, okunganciphisa ngokuphelele ukucindezeleka, kuvimbele ukuqhekeka kwamalunga e-solder nokuphuka kwezingxenye, futhi kuthuthukise ukusebenza kahle kokukhiqiza kanye nekhwalithi. Kusetshenziswa indlela yommese oyisiyingi ongaphezulu kanye nommese oyisicaba ophansi, ibhodi libekwa phezu kommese oyisicaba ophansi. Uma iswishi inyathelwa, ummese ongaphezulu oyindilinga uhamba ubheke endaweni emisiwe, ezonqamula ibhodi le-PCB. Ummese oyisiyingi ongaphezulu usike ngaphandle kokuhlubula, futhi ukusika kubushelelezi futhi akunamthungo. imiphetho emangelengele.

Le mishini isebenzisa amasethi amaningi emimese ukwenza imisebenzi yokusika eminingi ngesikhathi esisodwa ukuze kuthuthukiswe ukusebenza kahle kokukhiqiza.

Lesi sisetshenziswa sisebenzisa amasethi ama-2 wamablade aphezulu naphansi ukuze asike imisebenzi.

Ukwamukela idizayini yakamuva yomoya kanye nesisindo esincane, ingaqedela ukugunda okungagxili kwe-shear ngesikhathi esisodwa, ikakhulukazi ukusika okunembayo kwe-SMD noma amapuleti amancane. Awekho ama-BOW WAVES kanye nama-MICRO CRACK akhiqizwa ngesikhathi sokuxhunywa kommese oyindilinga. Sebenzisa ama-cutters amise okwe-wedge ukuze ukhiphe ngendlela eqondile, unciphise ukucindezelwa kwe-shear ukuze izingxenye ezibucayi ze-SMD kanye nama-capacitor angathinteki. Izingozi ezingaba khona zekhwalithi yomkhiqizo ziyancishiswa. I-stroke yokusika ingaphansi kwe-1-2MM, ngakho-ke akukho ukukhathazeka mayelana nokuphepha kokusebenza. Ithuluzi lenziwe ngensimbi enesivinini esikhulu kanye nomhlabathi onembile futhi lingagaywa futhi lisetshenziswe ngokuphindaphindiwe. Ibuye ilungele imisebenzi yokuhlukanisa ipuleti elincane ngaphandle kwe-V-CUT.

I-splitter ezenzakalelayo ngokugcwele iyidivayisi esetshenziselwa ukuhlukanisa ama-PCB futhi ngokuvamile isetshenziswa emigqeni yokukhiqiza. Ingakwazi ukusika futhi ihlukanise ngokuzenzakalelayo ama-PCB amakhulu abe ama-PCB amancane osayizi odingekayo, ithuthukise ukusebenza kahle kokukhiqiza nokunciphisa izindleko zabasebenzi.