E-by
- Umshini Wokumaka
- Umshini Wokuhlola
- I-Smart Warehousing Machine
- Umshini wokufaka ngokuzenzakalelayo
- Umshini Wokuhlanganisa Ohlelekile
- Umshini Wokuthungatha we-PCB
- Umshini Wokuhlanza
- Umshini Wokuphatha we-PCB
- Ihhavini
- Iphrinta
- Khetha bese Ubeka Umshini
E nge-DEK - Iphrinta ye-ASM Inline Solder Namathisela
Izici
I-E-Quality
Ochwepheshe bokuphrinta be-DEK abanolwazi olunzulu bathuthukise inkundla ye-E by DEK enezingxenye zekhwalithi ephezulu, ukwakhiwa okuyinkimbinkimbi, kanye nedizayini eyimojula eqinisekisa inqubo yokuphrinta ezinzile nethembekile ngisho nezinhlelo zokusebenza zakamuva zephimbo elihle.
I-E-Performance
I-E by DEK iletha i-E-Performance nge:
8 amasekhondi core umjikelezo wesikhathi
Ukushintshwa kokusetha okusheshayo
Ukuphindaphinda okuphezulu
Ngezikhathi zomjikelezo ezimfishane kanye nokushintshwa komkhiqizo okusheshayo okubhangqwe nokunemba okukhulu okuphindayo, i-E nge-DEK ibeka izindinganiso ezintsha engxenyeni yesivinini esimaphakathi.
E-Amaqiniso
Ihlelwe ngokusobala, futhi inombolo ngayinye ihlinzeka ngempikiswano eqinile: Amaqiniso abaluleke kakhulu nezibalo ku-E nge-DEK.
* Iziqu zokuqondanisa zihlanganisa ukulayisha/ukukhipha ibhodi, ukugoqa ibhodi, ukunyakaza kwekhamera/kwetafula. Inani lamandla libalwa nesofthiwe ye-QC-Calc yenkampani yangaphandle.
# Amandla omshini ahlanganisa ukulayisha/ukukhipha ebhodini, ukubamba ibhodi, ukunyakaza kwekhamera/ukukhuphuka kwetafula kanye nenqubo yokuphrinta. Inani lamandla libalwa nesofthiwe yenkampani yangaphandle ye-QC-Calc.
E ngo-DEK
Ukuvumelana nezimo ngezinga eliphezulu!
Imboni ngayinye ye-SMT inezinselelo zayo ezikhethekile. Kungakho sithuthukise Izinketho ze-E by DEK ezivumela ukushuna kwangokwezifiso namamojula ahlanganiswe kahle ukuze aphrinte imiphumela ezojabulisa amakhasimende akho futhi inyuse ukukhiqizwa kwakho kwe-SMT kufike ezingeni elisha.
Izinketho ze-E by DEK zazo zonke izinhlelo zakho zokusebenza:
Okokusebenza
Ikhwalithi
Ukuvumelana nezimo
Amabhodi wesifunda amade nasindayo
| Ukuqondanisa | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
| Amandla wokuqondanisa uhlelo | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
| Isikhathi esingcono kakhulu somjikelezo oyinhloko | 8 imizuzwana |
| Usayizi we-substrate | 50 mm (X) x 40.5 mm (Y) kuya ku-620 mm (X) x 508.5 mm (Y) |
| Isistimu esebenzayo | I-Windows 7 ishumekiwe |
| I-Squeegee pressure mechanism | Ilawulwa yisoftware, enenjini enempendulo yeluphu evaliwe |
| Ukuma kwestencil | Umthwalo we-semi-auto stencil onethreyi yokudonsa |
| Ukuhlanza i-understencil | Isihlanzi se-understencil esishintshashintshayo (IUSC), ehleleleka ngokugcwele ngokusula okumanzi/okomile/ngevacuum |
| Ukukhweza kwe-stencil okuguquguqukayo-ububanzi (AWSM) | Okuhlukile kozimele - kulungiseka ngokugcwele ukuze kuthwale osayizi bozimele kububanzi obungu-381 mm ukuya ku-736 mm |
| Ubukhulu be-substrate | 0.2 mm kuya ku-6 mm |
| Isisindo se-substrate (esiphezulu) | 6 kg |
| I-warpage ye-substrate | Kufika ku-7 mm kufaka phakathi ukujiya kwe-substrate |
| Ukulungiswa kwe-substrate | Ngaphezulu kwe-clamp I-Edge clamp I-clamp engena-foil Vacuum |
| Inzwa yokushisa nomswakama | Ukuqapha isimo senqubo |