- Umshini Wokumaka
- Umshini Wokuhlola
- I-Smart Warehousing Machine
- Umshini wokufaka ngokuzenzakalelayo
- Umshini Wokuhlanganisa Ohlelekile
- Umshini Wokuthungatha we-PCB
- Umshini Wokuhlanza
- Umshini Wokuphatha we-PCB
- Ihhavini
- Iphrinta
- Khetha bese Ubeka Umshini
I-HS60- PARMI 3D SPI Umshini Wokuhlola I-Solder Namathisela Osetshenzisiwe
Imininingwane | ||||||
I-SPI Uchungechunge | HS60 Uchungechunge | HS70 Uchungechunge | HS70DH | |||
Ikhamera ye-3D | Ikhanda Lenzwa | I-RSC5 | (Okuphakeme) RSC6-HS | I-RSC6-HS | I-RSC6-HR | I-RSC6-HSx2 |
| Isivinini sokuskena (sq.cm/sec) | 60 | 100 | 100 | 80 | 100 |
| X,Y Ukulungiswa(um) | 18x18 | 13x13 | 13x13 | 10x10 | 13x13 |
| Ubude Bendawo (mm) | amashumi amabili nantathu | 32 | 32 | amashumi amabili nambili | 32 |
| Ukulungiswa kobude(um) | 0.2 | 0.2 | 02 | 0.1 | 02 |
Ukusebenza | Ukuphindaphinda | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma | 3 Sigma |
| Ukunemba(um/Ubude) | 2 | 2 | 2 | 2 | 2 |
| I-Gage R&R |
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Isilinganiso | I-Min.Solder Namathisela Usayizi(um) | 200×200 | 150x150 | 150x150 | 100x100 | 150x150 |
| I-Max.Solder Namathisela Usayizi(owodwa) | 20x20 | 20×20 | 20×20 | 20×20 | 20x20 |
| I-Min.Solder Namathisela Iphimbo(eyodwa) | 100 | 100 | 100 | 80 um | 100 |
| I-Max.Solder Namathisela Ukuphakama(okukodwa) | 1000um | ||||
| Isilinganiso ltem | Ubude, Indawo, Ivolumu, I-Offset, Ibhuloho, Isimo, I-Warpage, i-PCB iyashwabana | Ubude, Indawo, Ivolumu, I-Offset, Ibhuloho, Isimo, I-Warpage, i-PCB iyashwabana | Ubude, Indawo, Ivolumu, I-Offset, Ibhuloho, Isimo, I-Warpage, i-PCB iyashwabana | Ubude, Indawo, Ivolumu, I-Offset, Ibhuloho, Isimo, I-Warpage, i-PCB iyashwabana | Ubude, Indawo, Ivolumu, I-Offset, Ibhuloho, Isimo, I-Warpage, i-PCB iyashwabana |
| I-PCB Warpage | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) | ±5mm(2%) |
Ibhodi | Ubuncane besayizi(L*W) | I-H860,60L: 50×50 | HS60, 60L Supreme.50×50 | HS70:80×80 | 80×80 | 80×80 |
| Ubukhulu obukhulu | HS60: 360×260 | I-HS60 Ephakeme: 340x260 | HS70D: 420×350 | HS70D: 340×315 | 350×250 |
| Ubukhulu | 0.4mm ukuze 4mm | ||||
| PHEZULU/Ngezansi | HS60: 25/25 | I-HS60 Ephakeme: 25/25 | 0 | 4/23 | 4/20 |
| PHEZULU/Ngezansi | HS60, 60L, 60XL: 2.5/3.5 | I-HS60, 60L, 60XL Ephakeme: 2.5/3.5 | HS70, 70L: 2.5/3.5 | HS70D, 70DL: 2.5/3.5 | 2.5/4.0 |
| PCB Isisindo(kg) | HS60: 2 | HS70: 2 | 1.5 | ||
Ikhompyutha& | CPU | I-Intel i3-2100(3.1G) | I-Intel i3-2100(3.1G) | I-Intel i3-2100(3.1G) | I-Intel i3-2100(3.1G) | I-Intel i3-2100(3.1G) |
| Inkumbulo(GB) | HS60, HS60L: 8 | 8 | HS70: 8 | 16 | 8 |
| Gada | 20*Ububanzi | ||||
| Isistimu esebenzayo | I-MS-Windows XP Professional 64bit/Window 7 | ||||
Isisetshenziswa | Amandla(kw) | I-AC 220V (50/60Hz, Isigaba esingu-1) | ||||
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| HS60:1.5 | 2.3 | HS70: 1.7 | 2.3 | 3.5 |
| Umoya | 5Kgf/sq.cm | ||||
Uhlelo | Ubukhulu | HS60: 900x1000xl480 | I-HS60 Supereme: 900x1000x1480 | HS70: 970x1195x1535 | HS70D 1:920x1415x1510 | 1296x1980x1510 |
| Isisindo(kg) | HS60: 750 | I-HS60 Supereme: 750 | HS70:800 | 900 | 1000 |
Izinketho Zokukala Ubude{Calibration Jig}, Isistimu Yebhakhodi Ye-2D Ye-1D,Isistimu Ye-Loop Evaliwe |