Imikhiqizo

Iisingeniso

1. Isistimu yokuhlanza amaconsi

Isakhiwo sokuhlanza i-Drip sivimbela ngempumelelo ishubhu elincibilikayo ukuthi lingavimbeli imbobo futhi libangele ukusula okungancibiliki kwasendaweni nokungahlanzekile.

2. Idizayini yesakhiwo se-scraper esisha sha

Isakhiwo esisha se-scraper sikaloliwe wesilayidi nesilinda sithuthukisa ukuzinza kokusebenza futhi sandise impilo yesevisi.

3. Umhlahlandlela wesistimu yokumisa ujantshi

Ilungelo lobunikazi lokusungula imodeli yensiza yamazwe ngamazwe. Idivayisi ye-clamp eseceleni ekhiphekayo nehlelekayo yenza ukucaba okuhlukile okuphezulu kwamabhodi athambile nama-PCB asontekile. Ingahoxiswa ngokuzenzakalelayo ngohlelo lwesofthiwe ngaphandle kokuthikameze ubukhulu bethini.

4. Uhlelo lwekhamera yedijithali ye-CCD

Isistimu entsha ye-optical path-uniform annular light kanye nokukhanya okuphezulu kwe-coaxial, enokukhanya okuguquguqukayo okuguquguqukayo, yenza zonke izinhlobo zamaphoyinti kaMark zibonakale kahle (okuhlanganisa namaphoyinti kaMark angalingani) ukuze azivumelanise ne-tin-plated, copper-plated. , afakwe ngegolide, afuthwe ngethini, ama-FPC nezinye izinhlobo zama-PCB anemibala ehlukene.

5. Iplathifomu yokuphakamisa yokulungiswa kokuqina kwe-PCB enembayo ephezulu

Isakhiwo esiqinile nesinokwethenjelwa, ukuphakamisa nokwehlisa okuzinzile, ukulungiswa okuzenzakalelayo kwesofthiwe ye-PIN, kungalungisa ngokunembile ubude bendawo yamabhodi e-PCB anobukhulu obuhlukahlukene.

6. Isikhombikubona esisha semisebenzi eminingi

Ilula futhi icacile, kulula ukuyisebenzisa. Umsebenzi wokulawula kude wokushisa wesikhathi sangempela.

Incazelo

Iphrinta ye-automatic solder paste iphrinta yokubona okuzenzakalelayo enembayo ephezulu futhi ezinzile. Inkampani ye-GKG ilandela inkambiso yentuthuko yemboni ye-SMT. Isizukulwane esisha sephrinta yokubona okuzenzakalelayo sivunyelaniswa nobuchwepheshe obuhamba phambili bamazwe ngamazwe, ukucutshungulwa okubonakalayo kokucaca okuphezulu. , Isistimu yokushayela enembile, Ukumisa i-adaptive scraper, ukucutshungulwa kwepuleti okunembile kanye nesakhiwo sokubopha ifreyimu ehlakaniphile, isakhiwo esihlangene, kokubili ukunemba kanye nezinga eliphakeme lokuguquguquka, inikeza amakhasimende umsebenzi ophumelelayo, onembile odingekayo wokuphrinta, amakhasimende amaningi ahlinzeka ngentengo evelele.

Incazelo

Umshini wokunyathelisa we-GKG G9 othomathikhi wokunamathisela ithini uyimodeli ephezulu yokuphela kwesicelo se-SMT esiphezulu, esingakwazi ukwanelisa izidingo zenqubo yokuphrinta ye-03015,0.25 pitch, ukunemba okuphezulu kanye nesivinini esikhulu.

I-G9 inemba eliphezulu kanye nokuzinza okuphezulu kombono womshini wokunyathelisa ozenzakalelayo ngokugcwele, i-GKG elandelwa embonini ye-SMT iwumkhuba wokuthuthukiswa kokukhiqizwa kwesizukulwane esisha somshini wokunyathelisa othomathikhi onombono ohambisanayo wobuchwepheshe ohamba phambili emhlabeni jikelele, ukucubungula okubukwayo kokuxazulula okuphezulu, okuphezulu. ukunemba kwesistimu yokudlulisela, i-suspension adaptive scraper.

Incazelo

I-G5 inemba eliphezulu kanye nokuzinza okuphezulu kombono womshini wokunyathelisa ozenzakalelayo ngokugcwele, i-GKG elandelwa embonini ye-SMT iwumkhuba wokuthuthukiswa kokukhiqizwa kwesizukulwane esisha somshini wokunyathelisa othomathikhi onombono ohambisanayo wobuchwepheshe ohamba phambili emhlabeni jikelele, ukucubungula okubukwayo kokuxazulula okuphezulu, okuphezulu. ukunemba kwesistimu yokudlulisela, i-suspension adaptive scraper.

Incazelo

I-DEK NeoHorizon iX ikhanya ngaphezu kwalokho

umklamo omusha. I-modular ingaphakathi lithuthukisiwe kakhulu futhi linokwethenjelwa kakhulu. Kungakhathaliseki ukuthi kusekwenziweni kwezinkontileka ezixubene kakhulu noma izinhlelo zokusebenza zevolumu ephezulu ezinezidingo zokukhipha okuphezulu - i-DEK NeoHorizon iX iyinkundla yokuphrinta efanele.

Izici

• Inketho yokukhishwa kwebhodi ye-Stinger Camera ekhweziwe
• Namathisela ukuqapha ukuphakama kwe-roll
• Impendulo ye-Squeegee pressure
• I-Semi Automatic Stencil Load
• I-DEK Cyclone ngaphansi kwenketho yokuhlanza isikrini
• Ukukhweza isikrini okungalungiseka

Iphrinta ye-stencil ye-DEK Horizon 02i SMT:
PCB Usayizi (LxW): 50x50mm ukuze 508x510mm
Uhlobo lwekhamera: 198040 DEK Graphite Camera, 198041 DEK CBA40 Green Camera, 198042 DEK Gold Camera noma 198043 DEK Hawkeye 750 Ikhamera (Ongakukhetha)
Isicoci Sestencil: Ngaphansi kuka-500mm I-Stencil Sula eluhlaza okwesibhakabhaka
Inguqulo yesofthiwe: 09SP08
Ithuluzi: Izikhonkwane zamathuluzi kazibuthe / i-vacuum kanye negridi-lok (NGOKUZITHANDELA)
Uhlobo Lwesistimu Yezokuthutha: Ujantshi Wangaphambili Ulungisiwe kanye nesigaxa sebhodi noma inketho
Isiqondiso Sesistimu Yezokuthutha: Ukusethwa kwesistimu
Ubukhulu be-PCB: 0.2-6MM
Isisindo se-substrate: 0-1kg
Usayizi Wozimele Wesikrini: 29″x29”

Omunye umsebenzi:

Ukuqondanisa kwe-Auto Fiducial
I-Auto Rail Width
I-Beacon Ehlelekayo
Inethiwekhi
Umsebenzi wokuhlola we-2D
I-SMEMA ejwayelekile

Amandla kagesi: AC 110V–220V 50-60Hz
Isisindo somshini: 700Kg
Usayizi Womshini: L1400xD1800xH1500mm

Izici

I-E-Quality
Ochwepheshe bokuphrinta be-DEK abanolwazi olunzulu bathuthukise inkundla ye-E by DEK enezingxenye zekhwalithi ephezulu, ukwakhiwa okuyinkimbinkimbi, kanye nedizayini eyimojula eqinisekisa inqubo yokuphrinta ezinzile nethembekile ngisho nezinhlelo zokusebenza zakamuva zephimbo elihle.
I-E-Performance
I-E by DEK iletha i-E-Performance nge:
8 amasekhondi core isikhathi somjikelezo
Ukushintshwa kokusetha okusheshayo
Ukuphindaphinda okuphezulu
Ngezikhathi zomjikelezo ezimfishane kanye nokushintshwa komkhiqizo okusheshayo okubhangqwe nokunemba okukhulu okuphindayo, i-E nge-DEK ibeka izindinganiso ezintsha engxenyeni yesivinini esimaphakathi.
E-Amaqiniso
Ihlelwe ngokusobala, futhi inombolo ngayinye ihlinzeka ngokuphikisana okuqinile: Amaqiniso abaluleke kakhulu nezibalo ku-E nge-DEK.
* Iziqu zokuqondanisa zihlanganisa ukulayisha/ukukhipha ibhodi, ukugoqa ibhodi, ukunyakaza kwekhamera/kwetafula. Inani lamandla libalwa nesofthiwe ye-QC-Calc yenkampani yangaphandle.
# Amandla omshini ahlanganisa ukulayisha/ukukhipha ebhodini, ukubamba ibhodi, ukunyakaza kwekhamera/ukukhuphuka kwetafula kanye nenqubo yokuphrinta. Inani lamandla libalwa nesofthiwe yenkampani yangaphandle ye-QC-Calc.
E ngo-DEK
Ukuvumelana nezimo ngezinga eliphezulu!
Imboni ngayinye ye-SMT inezinselelo zayo ezikhethekile. Kungakho sithuthukise Izinketho ze-E by DEK ezivumela ukushuna kwangokwezifiso namamojula ahlanganiswe kahle ukuze aphrinte imiphumela ezojabulisa amakhasimende akho futhi inyuse ukukhiqizwa kwakho kwe-SMT kufike ezingeni elisha.
Izinketho ze-E by DEK zazo zonke izinhlelo zakho zokusebenza:
Okokusebenza
Ikhwalithi
Ukuvumelana nezimo
Amabhodi wesifunda amade nasindayo

Isingeniso

• Ubakaki olengayo oqinisiwe ukuze ugweme ukuwohloka kwesitimela kanye nokuminyana kwebhodi;
• I-Multi-layer thermal insulation design. Izinga lokushisa le-Surface lomzimba we-Oven lincishiswa
• 10 kuya ku-20 degrees, ukunciphisa izinga lokushisa kwendawo yokusebenza ngokuphumelelayo;
• Ukucushwa okusha kokupholisa ukwenza umoya obaselwe noma obuyisiwe ubuyele egumbini likahhavini, kungakwenza
• ukunciphisa ukulahlekelwa okushisayo kanye nokuthola ukuqoqwa okungcono kwe-flux;
• 15% ukusebenza kahle kokudlulisa ukushisa kwathuthukiswa ukuze kubhekwane nenqubo yamahhala eholayo nokuningi
• imikhiqizo eyinkimbinkimbi futhi emikhulu;
• I-dual-rails conveyor iyakwazi ukuthuthukisa ukusebenza kahle kokukhiqiza kanye nokonga amandla kanye
• izindleko;
• Sebenzisa isivikelo esigcwele sedizayini yehhavini evaliwe ukuvikela ukulahleka kwe-nitrogen. Ngakho ephansi
• ukuhlushwa kwe-oxygen kungafinyelelwa ku-150ppm;
• Ukusetshenziswa kwe-nitrogen kungu-20-22M/H kuphela ngezinga le-oxygen engu-300-800ppm;
• Isistimu yokulawula iluphu ye-nitrogen evaliwe iyakhethwa, yonga amandla kanye nokuvikelwa kwemvelo.

Incazelo:

• Umthamo omkhulu, isivinini esivamile sokuthutha sifinyelele ku-160cm/min. Ukusetshenziswa kwamandla okuphansi, izindleko eziphansi. Okukhethekile ukukhiqizwa ngesivinini kanye high ukuminyana PCBA ubuchwepheshe;
• Ukulawula izinga lokushisa okunamandla, ukusetha kanye nomehluko wangempela wokushisa ngaphakathi kwe-1.0 ℃, izinga lokushisa lokulayisha nokulayisha liyashintshashintsha phakathi kuka-1.5 ℃; Ikhono lokukhulisa izinga lokushisa elisheshayo, umehluko wokushisa phakathi kwendawo engumakhelwane engu-100 ℃;
• Indlela entsha yokufaka ukufakwa kwe-insulation kanye nomklamo omusha wegumbi kwaqinisekisa ukuthi izinga lokushisa elingaphezulu liyigumbi lokushisa +5C;
• Ikhwalithi ye-N² iyalawuleka kuyo yonke inqubo, ukuminyana kwe-O² okuvalekile kulawulwa ngokuzimela kokuthi 50-200ppm kuyo yonke indawo;
• Ubuchwepheshe bokupholisa obusha kakhulu, indawo yokupholisa ekabili ezinhlangothini eziningi, ubude obusebenzayo bokupholisa bungu-1400mm, qinisekisa ukupholisa okusheshayo komkhiqizo ukuze ufike ezingeni lokushisa eliphansi kakhulu;
• Uhlelo olusha lokuhlukanisa amaleveli amabili oluguquguqukayo oluneqoqo lezindawo eziningi elenza ukuhlukana kahle, ukuze isikhathi sokunakekela kanye nemvamisa kwehliswe kakhulu;
• Ulayini okabili ngesivinini esihlukile, izindleko ezibekiwe, umthamo ophindwe kabili, ukonga amandla angama-65%.

Inhloso evamile, uhlelo lokuhlola olungabhubhi

Ama-routers, izingxenye ze-elekthronikhi, izinto ze-LED

Amabhethri e-lithium, i-aerospace

Umshini wokuhlola i-X-7100 owethulwe unezinhlobonhlobo zezinhlelo zokusebenza. Ivamise ukusetshenziswa ekuhlolweni kwesakhiwo sangaphakathi sezingxenye ze-elekthronikhi, amabhamuza, isilinganiso sezinga elingenalutho, isifunda esifushane nesivulekile, amajoyinti e-solder angekho, i-solder engekho, ukuqhekeka kwezinto zangaphandle ngaphakathi, njll.

Inezici zokugcinwa okulula nokuphila isikhathi eside; ukusebenza okulula, ukunciphisa ukuqeqeshwa komsebenzisi; ukuphinda kutholakale okuphezulu; kanye nokuvumela i-engeli enkulu yokubuka engu-60 degrees ukuthola amasampula.

Ukudlulisa, ukuhlola okungabhubhisi

Ukupakishwa kwe-Semiconductor, imboni yezimoto, i-LED bonding, ibhethri ye-lithium, i-PCBA

Imishini yokuhlola i-semiconductor ye-elekthronikhi ye-X-9200, enobuncane bokunemba kokutholwa kwe-1um, ingasetshenziswa ukuthola ama-semiconductors wesifunda ahlanganisiwe, njenge-BGA, IGBT, i-flip chip kanye ne-PCBA component welding, i-LED bonding, ukupakishwa kwe-IC nezinye izimboni eziphezulu- ukuhlola ukunemba.