Umshini Wokuhlola

Inhloso evamile, uhlelo lokuhlola olungabhubhi

Ama-routers, izingxenye ze-elekthronikhi, izinto ze-LED

Amabhethri e-lithium, i-aerospace

Umshini wokuhlola i-X-7100 owethulwe unezinhlobonhlobo zezinhlelo zokusebenza. Ivamise ukusetshenziswa ekuhlolweni kwesakhiwo sangaphakathi sezingxenye ze-elekthronikhi, amabhamuza, isilinganiso sezinga elingenalutho, isifunda esifushane nesivulekile, amajoyinti e-solder angekho, i-solder engekho, ukuqhekeka kwezinto zangaphandle ngaphakathi, njll.

Inezici zokugcinwa okulula nokuphila isikhathi eside; ukusebenza okulula, ukunciphisa ukuqeqeshwa komsebenzisi; ukuphinda kutholakale okuphezulu; kanye nokuvumela i-engeli enkulu yokubuka engu-60 degrees ukuthola amasampula.

Ukudlulisa, ukuhlola okungabhubhisi

Ukupakishwa kwe-Semiconductor, imboni yezimoto, i-LED bonding, ibhethri ye-lithium, i-PCBA

Imishini yokuhlola i-semiconductor ye-elekthronikhi ye-X-9200, enobuncane bokunemba kokutholwa kwe-1um, ingasetshenziswa ukuthola ama-semiconductors wesifunda ahlanganisiwe, njenge-BGA, IGBT, i-flip chip kanye ne-PCBA component welding, i-LED bonding, ukupakishwa kwe-IC nezinye izimboni eziphezulu- ukuhlola ukunemba.

Imishini ye-X-160T-M ingaqondisa ngempumelelo imboni yamanje yokukhiqiza, izinkinga zemikhiqizo yokukhipha i-aluminium, efana nokuqhekeka, ukushwabana, i-porosity, i-trachoma noma okunye ukukhubazeka kwangaphakathi kokusakazwa kwe-aluminium, amaphutha angenhla angabangela ukulahlekelwa okukhulu kubasebenzisi bazo bokugcina. , njengokubangela ukwehluleka komkhiqizo ukulethwa. Njengamanje, imakethe ye-aluminium castings ikhula kancane, ikakhulukazi kwezinye izingxenye zokuphepha ezibalulekile zokukhiqiza, ngesidingo sokuphepha kokukhiqiza kanye nokuqinisekiswa kwekhwalithi yomkhiqizo, kuyadingeka ukusebenzisa imishini ye-X-Ray NDT ukuthola okuhle nokubi kwe-aluminium. ukusakaza.

Imishini yokuhlola i-semiconductor ye-elekthronikhi ye-X-7900 ingasetshenziswa ukuthola ama-semiconductors e-circuit chip ahlanganisiwe, njenge-BGA, IGBT, i-flip chip kanye ne-PCBA ingxenye yokushisela, ukuhlolwa kokunemba okuphezulu ku-LED, i-photovoltaic, irediyetha nezinye izimboni;

Isetshenziswa kakhulu emikhakheni yokukhiqiza yezimboni, njengezingxenye zezimoto, ukuhlolwa kokusakazwa, umkhumbi wengcindezi nokuhlolwa kwekhwalithi yokushisela amapayipi, nokuhlaziywa kwezinto ezintsha;

Ingakwazi ukubona amaphutha ezinhlotsheni ezahlukahlukene zamabhethri, njengamabhethri wamandla, amasilinda, ukupakisha okuguquguqukayo, amakesi ayisikwele namalaminates, njll.

Incazelo

3D PhakathiI-SigmaXUhlelo lokuhlola ukunamathisela kwe-solder luhlinzeka ngokusebenza okusha, okuhamba phambili embonini ukuze kwengeze inani ebhizinisini lakho.Ubuchwepheshe bamuva bokulinganisa, obuhambisana nezikhathi zomjikelezo oshesha kakhulu embonini kanye namathuluzi okusekela ezinqubo eziyingqayizivele, kukhulisa imbuyiselo yakho ekutshalweni kwezimali kanye nenzuzo yakho.

• Ubuchwepheshe be-laser obubili buqeda umthunzi.
• Ihambisana nayo yonke imibala ye-PCB, ukuphela nama-HASL.
• Ihlonza zonke izici, okuhlanganisa amabhore, i-vias, unqenqema lwebhodi kanye nama-crimps.
• Isivinini sokuhlola se-100?/sec ku-10×10 micron resolution, kanye nokufinyelela okusheshayo emiphumeleni, kunikeza ukusebenza okuhle kakhulu embonini.
• Ukuhlonipheka okuphezulu nokunemba ngezilinganiso zobude +/- 1mm

Incazelo

I-PARMI SPI HS60 ihlanganisa ubuchwepheshe obuthuthukisiwe abambalwa, okuhlanganisa ukubona okuhlakaniphile kwe-SMT, ubuchwepheshe bendawo nokuhlola (PnT), kanye nokudla kwamarobhothi okukhaliphile. Ifakwe amasethi amathathu emibhobho, amabili awo asetshenziselwa ukufaka umlomo wombhobho we-SMT kanye neyodwa yokubhaliswa kombono. Isistimu ifakwe i-auto-focus laser head ukuze uthole ukunemba okuphelele kokubhaliswa kwephini.

Impahla ye-SPI HS60 iyakwazi ukukhiqiza ivolumu ephezulu, enosayizi webhodi omkhulu ongu-10' x 10'. Iwumshini oguquguqukayo ngokwedlulele, okwazi ukucubungula izingxenye ezahlukahlukene, njenge-BGA nama-CSP, kanye nama-solder angenawo umthofu. Ngaphezu kwalokho, ifaka imojuli ye-chip elungiselelwe, evumela ukukhwezwa kwe-chip ngesivinini esikhulu. Leli khono, kanye nezinye izici zalo, lenza le modeli ifanelekele ukuhlanganiswa kwe-PCB nemisebenzi yokukhiqiza yamaphrojekthi aphakathi nendawo.

Incazelo
I-3D AOI Sensor Head (TRSC-I)
• Ikhamera ye-CMOS esheshayo (i-4Mega-pixel) enobuchwepheshe be-Dual Laser
• I-RGB LED Lights
• Ilensi yocingo
• Isisindo Esilula, I-Compact Sensor Head Design
• Isivinini Sokuhlola Esihamba Phambili Kwemboni: 65 cm2/isekhondi @ 14 x 14um
• Isikhathi Somjikelezo: Ku-PCB 260mm x 200mm = 10 amasekhondi afaka ukulayisha nokulayishwa

Lo mshini usetshenziselwa ukuhlola okuzenzakalelayo okuku-inthanethi kwe-glue yenqubo yokugqoka emigqeni yokukhiqiza.